1. Applied Materials introduces new materials and processes to scale copper wiring to 2nm and beyond, reducing resistance by 25%. 2. The company's innovations include a binary metal liner of ruthenium and cobalt (RuCo) and an enhanced low-k dielectric material, Black Diamond, for improved chip performance and 3D stacking. 3. These advancements are crucial for energy-efficient computing systems, especially in the AI era, and will continue to be developed and explored for future semiconductor technology.